DCB substrates

Ceramic copper clad laminate (DBC) is a composite material directly sintered with pure copper (99.95%) and alumina (96%, density ≥3.7g/cm3) (Al2O3)/aluminum nitride ceramic substrate. The thickness of the copper foil can be controlled between 0.2mm-1mm, which can be directly sintered according to the circuit pattern required by the customer, and the material meets the ROHS requirements.
DBC substrate performance
  It has excellent electrical insulation and thermal conductivity, high temperature resistance, humidity resistance, corrosion resistance, stable size and dielectric properties, and good heat dissipation. There is no difference in deformation and tensile force to prevent pulling off after welding; the double-sided copper clad process adapts to various welding methods and enhances welding reliability.
• Good mechanical stress, with high strength binding force;
• Up to 50,000 cold and hot cycles, high reliability;
• Wide operating temperature range (-55℃～850℃);
• Good heat dissipation performance, thermal conductivity ≥20w/m.K;
• Good electrical insulation performance, voltage resistance 20kv;
• The circuit pattern is directly bonded.
DBC circuit board application
  The DBC board has been widely used in hybrid circuits, electronic control circuits, semiconductor power modules, power supply blocks, solid state relays, high-frequency switch-mode power supply systems (SMPS), electric heating devices, LED lighting circuit boards, LED car lights, semiconductor refrigeration Devices, lasers, optoelectronic ceramic bases, microwave and aerospace fields.